Key Features of DELO DUALBOND EG4797

· Halogen- and Solvent-Free: This acrylate material enables intricate microstructure designs, known as micro dams, in semiconductor packaging and printed circuit boards (PCBs).

· Precision Dispensing: Achieves bondlines as narrow as 100 µm with an aspect ratio of five or more, a significant improvement over the previous benchmark of 200 µm.

· High Thixotropic Index: With a thixotropic index of 6.6, it allows for dispensing speeds of over 15 mm/s while maintaining stability in layer formation on both straight and curved surfaces.

· Fine Application: Utilizes conical needles with a diameter of 100 µm for dispensing fine bondlines.

Curing Options

After dispensing, the micro dam can be cured in a single step, offering flexible and energy-efficient options:

· UV Light: Cure in just 10 seconds.

· Heat: Cure in five minutes at +120 °C.

· Dual-Curing: Combine UV light and heat for optimal results.

Industry Compliance

DELO DUALBOND EG4797 has demonstrated compliance with industry standards such as JEDEC MSL, making it an excellent choice for microelectronics and semiconductor applications.

Applications

· Microstructures: Serve as flow stops and minimize keep-out zones (KoZ) on PCBs, enhancing the reliability of solder joints.

· Optical Packaging: In LED module manufacturing, micro dams function as precise optical barriers.

Unmatched Design Flexibility

The adhesive's capability to create ultra-fine micro dams allows for virtually limitless freeform structures, enabling unprecedented package layouts while minimizing space requirements.

Upcoming Exhibitions

DELO DUALBOND EG4797, along with other advanced packaging adhesives, will be showcased at:

· IMAPS Symposium:

September 30 to October 3, 2024, in Boston, Massachusetts, USA.

· IEMT:

October 16–18, 2024, in Penang, Malaysia.

This product represents a significant advancement in adhesive technology, catering to the increasing demand for high-performance electronic components.